All tools are compatible for Dielectric etching. 

Multiple applications :

        ·        Several dielectric materials concerned (SiO2, quartz, Fused silica, Borosilicate, Si3N4…)
        ·        Shallow etch
        ·        SiO2 mask opening
        ·        Buried layer removal
        ·        Deep dielectric etch
        ·        Two chemistries : CHF₃   or  CH₄

Hardware solutions are:

        ·     Specific Gas injection with optional gas box
        ·        Pressure gauge for sharper range control
        ·        Heated liner  to avoid polymer deposition on chamber side-wall for better maintenance
           and stability
        ·        Dedicated generator for optimized efficiency

Dielectric etching ending on stop layer has excellent monitoring combined with OES EPD solution.