The AMMS Bevel-Edge solution is the combination between a mechanical protection of the wafer periphery and the optimal properties of a pin-type ESC chuck. This configuration is specially required for Through Wafer applications (MEMS, 3D via).

·          Protection of wafer edge from the plasma (no etch of edge bead removal (EBR))
·          Same uniform thermal transfer capability as pin-type ESC chuck
·          Dual helium injection to enlarge the process window
·          Transfer by 3 pins located at wafer edge (no backside etch of the plasma ; compatible with
      most of mask layouts)
·          Universal chuck : fast size kit exchange between 4, 6 and 8 inches