The AMMS pin-type electrostatic clamping (ESC-pin) chuck is the latest version of clamping solution of silicon wafers.

That configuration leads to an excellent thermal uniformity across the wafer, thanks to the electrostatic clamping and a dual helium injection at the wafer backside. Also, the tilt of etched features at the wafer periphery is greatly improved compared to any previous generation of ESC or mechanical chuck. 

·          Reduced edge exclusion

     o    Reduced profile angle edge exclusion (no tilt at 3mm from wafer edge)
     o    Better and uniform thermal transfer capability (±1% compared to ±7% on standard ESC)
·          Dual helium injection to enlarge the process window
·          Transfer by 3 pins located at wafer edge
     o    No backside etch of the plasma
     o    Compatible with most of mask layouts
·          Universal chuck : fast size kit exchange between 4, 6 and 8 inches