The new interferometric camera allows an insitu control of the processed wafer. The system offers an automatic endpoint detection using IR laser spot focused on the wafer and also provide a real time image of the wafer on the Windows software application. The interferometric camera system can automaticaly trigger endpoint and stop the DRIE tool with possible overetch. 

• Versatile LEM Camera series including laser interferometric camera and endpoint detector
• Measures in real-time mask etch rates and trench depth for standard semiconductor processes
• Detects interfaces (EPD) for standard and Bosch processes (ex SOI wafers)
• Real-time digital CCD image of the wafer surface for accurate laser spot positioning
• Available for AMS100, AMS110, AMS200, AMS4200, AMS3200