Alcatel MicroMachining Systems is designing, manufacturing and selling wafer processing equipments for DRIE plasma etching as well as PECVD.

The product range is composed of:
- AMS 110 "I-Speeder", a single wafer manually loaded equipment with one Process Module,
- AMS 200 "I-Productivity", a stand-alone cassette to cassette equipment with one Process Module,
- AMS 3200, a single vacuum cassette cluster with up to three Process Modules,
- AMS 4200, a dual vacuum cassette cluster with up to four Process Modules.

Each Process Module can be a:
- Silicon Etching (SE) module,
- Dielectrics Etching (DE) module,
- Low temperature PECVD (PE) module for SiO2 and Si3N4.
 
The Process Modules have been designed to meet highest integration with best maintainability.All Process Modules are equipped with a high density, low pressure Alcatel patented ICP plasma source, high vacuum pumping systems, gas box, facility panel, control and energy rack.A choice of Mechanical or Electrostatic wafers chucks allows adapting all range of wafer design and applications.