Alcatel process solutions consist of the most recent capabilities in DRIE for etching Silicon materials and Glass like materials as well as PECVD solutions for depositing isolation layers like SiO2 and Si3N4.Depending on the required process type, a choice between different process modules is available:

• Silicon Etch (SE)
• Dielectric Etch (DE)
• LTPECVD for SiO2/Si3N4(PE)