AMMS COMPANY BACKGROUND
Alcatel Micro Machining Systems (AMMS) is a subsidiary of Alcatel Vacuum Technology France located in Annecy, France. AMMS is specialized in designing, manufacturing, marketing and servicing ICP, DRIE, deep plasma etching systems for the fabrication of MEMS, Micro Electro Mechanical Systems and 3D Semiconductors. Its main application markets are the telecommunications, automotive, aerospace, computer peripherals, biomedical industries, power devices and wafer level packaging.AMMS is committed to support its customers through an international network of sales and service offices. Four applications laboratories in France, USA, Taiwan and Japan provide its customers with process development and process demonstration. At the beginning of 2007, AMMS had a worldwide ICP etching tool installation base of more than 200 sites in the United States, Europe and Asia. Main markets served are: MEMS · Inertial Sensors: Gyroscopes, Accelerometers
· Mobile Phones Devices: Silicon Microphones, RF MEMS
· Ink Jet Printer Heads
· Tire Pressure Monitoring Systems
· Biomedical integrated Devices 3D SEMICONDUCTORS, WAFER LEVEL PACKAGING
· 3D Interconnections: Through Silicon Via
· 3D Imaging Sensors
· 3D Active Power Devices: Diodes, Transistors
· 3D Passive Power Devices: Capacitors, Inductors, Resistors These products are finding their final application in the following markets:
· Automotive
· Telecommunications
· Information Technology
· Health Care and Environment
· Data Storage and Memory Chips
· Portable Electronic Equipments PRODUCT RANGE AMS 110 “I-Speeder”
The new ICP Deep Reactive Ion Etching tool AMS 110 “I-Speeder” is the direct result of 25 years of Plasma Processing Technology within Alcatel Vacuum Technology. Its design makes it the ideal solution for MEMS Development, Prototyping and Small Production Manufacturing. Its process performances are entirely compatible with AMS 200 “I-Productivity“ volume Production tool. The AMS 110 “I-Speeder” is designed to achieve the typical etch performances required by MEMS customers during the development stage of complex MEMS devices. High flexibility is needed to process different kinds of wafer with a large range of materials, patterns and designs with superior etch performances. With its very high aspect ratio trench etch and profile control capabilities, the AMS 110 SE ”I-Speeder” offers the key technology to meet the specific deep silicon plasma etching requirements of MEMS designers and manufacturers. The new AMS 110 “I-Speeder” equipment consists of a single wafer vacuum load lock connected to a process chamber fitted with an Alcatel patented high-density, low-pressure ICP source and a temperature-controlled substrate holder. The ICP reactor offers the possibility of using 3 different etching regimes without hardware configuration change: the “Bosch“ process, the Cryogenic process and the conventional Continuous process. High performance Adixen vacuum pumps are connected to the load lock and to the process module for evacuation of reactive gases and by-products. The AMS 110 SE “I-Speeder“ offers advanced performances in deep etching of silicon, while the AMS 110 DE “I-Speeder” is the dedicated tool for etching dielectric layers, like SiO2 and glass-like materials. With its wafer size capability ranging from 100 mm to 200 mm, the proposed wafer holding method can be mechanical or electrostatic clamping. The wafer transfer from load lock to process chamber can be manual or automatic. In every case, the maintenance access has always been facilitated despite a high degree of integration and an extremely reduced footprint in a ballroom or through the wall configuration. The system can adapt up to 14 process gas lines and the PC/PLC control system is user-friendly Windows 2000 TM operator interface. AMS 200 “I-Productivity” The Alcatel AMS 200 “I-Productivity” is the best adapted DRIE solution for 3D-SiP and MEMS volume manufacturing. The Alcatel AMS 200 “I-Productivity” is designed to achieve high throughput with low Cost of Ownership, thanks to extended cleaning frequency, limited edge exclusion, high etch rate, excellent process stability and high etch uniformity The optimization of the Bosch process has shown ultra high Silicon etch rate, with unrivaled uniformity and repeatability leading to excellent process yield. The AMS 200 “I-Productivity” performances are obtained thanks to the use of a wide range of proprietary design and process improvements, such as the Alcatel patented heated liner, and the Alcatel patented S.H.A.R.P. (Super High Aspect Ratio Process) process. AMS 3200/4200 Cluster tools The new AMS 3200, AMS 4200 product line is providing the most recent process capabilities in DRIE for etching Silicon materials and Glass like materials as well as PECVD solutions for depositing isolation layers like SiO2 and Si3N4. The AMS 3200 and AMS 4200 multi chamber and multi process platforms are the perfect tools from pilot lines to mass volume production in the field of MEMS and 3D Semiconductors. AMS 3200 is a cost effective cluster tool platform with 3 positions available for Process Modules. It incorporates a single vacuum cassette station with manual door and a single end effector vacuum transfer arm. AMS 4200 is a volume production cluster platform with a capacity for up to 4 Process Modules featuring a dual vacuum cassette with automatic doors, dual end effector vacuum robot handling and a built in buffer station. Each handling module is based on BROOKS field proven stations compatible with the highest Quality and Semiconductor Standards. AMS 3200 and AMS 4200 can be configured for wafer sizes ranging from 100mm to 200mm and are both featuring automatic cassette mapping, pre-alignment and are pumped using ADIXEN dry roughing pumps and Maglev Turbo molecular pumps. Control systems are based on local Ethernet with distributed controllers and I/O system. Host SECS II/GEM/HSMS and user’s friendly Windows 2000 Pro operator interfaces are used for process Control, System status, Maintenance, Data Acquisition, Batch Report, Events tracking and diagnostics functions. THE HIGHEST FLEXIBILITY WITH A WIDE CHOICE OF PROCESS SOLUTIONS All Process Modules are equipped with a high density, low pressure Alcatel patented ICP plasma source , high vacuum pumping systems, gas box, facility panel, control and energy rack. A choice of Mechanical or Electrostatic wafers chucks allow to adapt all range of wafer design and applications. SILICON ETCHING (SE):
· Bosch DRIE
· Cryo Process
· High Etch rate
· High mask selectivity
· Super High Aspect Ratio ( Alcatel patented SHARP Process )
· Patented Heated liners
· End Point Detection Options DIELECTRIC ETCHING (DE):
· Deep etching of SiO2,Quartz,Fused silica, borosilicate and glass like materials
· High Etch rate
· High Selectivity
· High Aspect ratio
· Vertical profiles
· Smooth side walls PECVD (PE):
· Deposition of SiO2 and Si3N4 at room temperature
· Excellent Step coverage
· High deposition rates
· Uniform thickness
· Quality layers with high resistivity and high refractive index. All Process Modules are equipped with a high density, low pressure Alcatel patented ICP plasma source , high vacuum pumping systems, gas box, facility panel, control and energy rack. A choice of Mechanical or Electrostatic wafers chucks allow to adapt all range of wafer design and applications.
